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Features
* * * * * * * * *
Dual ADC with 8-bit Resolution 500 Msps Sampling Rate per Channel, 1 Gsps in Interlaced Mode Single or 1:2 Demultiplexed Output LVDS Output Format (100) 500 mVpp Analog Input (Differential Only) Differential or Single-ended 50 PECL/LVDS Compatible Clock Inputs Power Supply: 3.3V (Analog), 3.3V (Digital), 2.25V (Output) LQFP144 Package Temperature Range: - 0C < TA < 70C (Commercial Grade) - -40C < TA < 85C (Industrial Grade) * 3-wire Serial Interface - 16-bit Data, 3-bit Address - 1:2 or 1:1 Output Demultiplexer Ratio Selection - Full or Partial Standby Mode - Analog Gain (1.5 dB) Digital Control - Input Clock Selection - Analog Input Switch Selection - Binary or Gray Logical Outputs - Synchronous Data Ready Reset - Data Ready Delay Adjustable on Both Channels - Interlacing Functions: Offset and Gain (Channel to Channel) Calibration Digital Fine SDA (Fine Sampling Delay Adjust) on One Channel - Internal Static or Dynamic Built-In Test (BIT)
Dual 8-bit 500 Msps ADC
AT84AD004 Smart ADC
Performance
* * * * * * * * * Low Power Consumption: 0.7W per Channel Power Consumption in Standby Mode: 120 mW 1 GHz Full Power Input Bandwidth (-3 dB) SNR = 43 dB Typ (7.0 ENOB), THD = -53 dBc, SFDR = -55 dBc at Fs = 500 Msps Fin = 250 MHz 2-tone IMD3: -54 dBc (249 MHz, 251 MHz) at 500 Msps DNL = 0.25 LSB, INL = 0.5 LSB Channel to Channel Input Offset Error: 0.5 LSB Max (After Calibration) Gain Matching (Channel to Channel): 0.5 LSB Max (After Calibration) Low Bit Error Rate (10-15) at 500 Msps
Application
* * * * Instrumentation Satellite Receivers Direct RF Down Conversion WLAN
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Description
The AT84AD004 is a monolithic dual 8-bit analog-to-digital converter, offering low 1.4W power consumption and excellent digitizing accuracy. It integrates dual on-chip track/holds that provide an enhanced dynamic performance with a sampling rate of up to 500 Msps and an input frequency bandwidth of 1 GHz. The dual concept, the integrated demultiplexer and the easy interleaving mode make this device user-friendly for all dual channel applications, such as direct RF conversion or data acquisition. The smart function of the 3-wire serial interface eliminates the need for external components, which are usually necessary for gain and offset tuning and setting of other parameters, leading to space and power reduction as well as system flexibility.
Functional Description
The AT84AD004 is a dual 8-bit 500 Msps ADC based on advanced high-speed BiCMOS technology. Each ADC includes a front-end analog multiplexer followed by a Sample and Hold (S/H), and an 8-bit flash-like architecture core analog-to-digital converter. The output data is followed by a switchable 1:1 or 1:2 demultiplexer and LVDS output buffers (100). Two over-range bits are provided for adjustment of the external gain control on each channel. A 3-wire serial interface (3-bit address and 16-bit data) is included to provide several adjustments: * * * * * Analog input range adjustment (1.5 dB) with 8-bit data control using a 3-wire bus interface (steps of 0.18 dB) Analog input switch: both ADCs can convert the same analog input signal I or Q Gray or binary encoder output. Output format: DMUX 1:1 or 1:2 with control of the output frequency on the data ready output signal Partial or full standby on channel I or channel Q Clock selection: - - - * * * * Two independent clocks: CLKI and CLKQ One master clock (CLKI) with the same phase for channel I and channel Q One master clock but with two phases (CLKI for channel I and CLKIB for channel Q)
ISA: Internal Settling Adjustment on channel I and channel Q FiSDA: Fine Sampling Delay Adjustment on channel Q Adjustable Data Ready Output Delay on both channels Test mode: decimation mode (by 16), Built-in Test
A calibration phase is provided to set the two DC offsets of channel I and channel Q close to code 127.5 and calibrate the two gains to achieve a maximum difference of 0.5 LSB. The offset and gain error can also be set externally via the 3-wire serial interface. The AT84AD004 operates in fully differential mode from the analog inputs up to the digital outputs. The AT84AD004 features a full-power input bandwidth of 1 GHz.
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Figure 1. Simplified Block Diagram
CLKI Clock Buffer DDRB Divider 2 to16 DRDA I
LVDS Clock Buffer
2
CLKIO
16 DoirI VINI VINIB Gain control I Calibration Gain/offset ISA I BIT Input switch INPUT MUX Gain control Q Calibration Gain/offset ISA Q & FiSDA DoirQ VINQ VINQB + S/H 8bit ADC Q DMUX 1: 2 or 1: 1 Q LVDS buffe r Q 3-wire Serial Interface 3WSI DMUX control 2 + S/H 8bit ADC I DMUX 1:2 or 1:1 I LVDS Buffer I
DOAI DOAIN DOBI DOBIN DOIRI DOIRIN
16 2
8
DMUX control Data Clock Ldn Mode DOIRQ DOIRQN DOAQ DOAQN DOBQ DOBQN
16 16
8
CLKQ Clock Buffer DDRB Divider 2 to 16 DRDA Q LVDS Clock Buffer 2 CLKQO
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Typical Applications
Figure 2. Satellite Receiver Application
Satellite
Low Noise Converter (Connected to the Dish) Bandpass Amplifier Bandpass Amplifier Low Pass Filter
Satellite Tuner Tunable Band Filter IF Band Filter
Dish
11..12 GHz
1..2 GHz Synthesizer 1.5 ... 2.5 GHz
AGC
Local Oscillator
I Control Functions: Clock and Carrier Recovery... Q
I AT84AD004
I Local Oscillator 0 Q 90
Q
Clock Q Quadrature Demodulation
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Figure 3. Dual Channel Digital Oscilloscope Application
Channel B
Analog Switch
DAC Gain
A
ADC B
DAC Offset DAC Offset
FISO RAM ADC A
P
Display
Channel A A
DAC Gain
Channel Mode Selection
Clock Selection Timing Circuit
DACs
Smart Dual ADC
DACs
Absolute Maximum Ratings
Parameter Analog positive supply voltage Digital positive supply voltage Output supply voltage Maximum difference between VCCA and VCCD Minimum VCCO Analog input voltage Digital input voltage Clock input voltage Maximum difference between VCLK and VCLKB Maximum junction temperature Storage temperature Lead temperature (soldering 10s) Note: Symbol VCCA VCCD VCCO VCCA to VCCD VCCO VINI or VINIB VINQ or VINQB VD VCLK or VCLKB VCLK - VCLKB TJ Tstg Tleads Value 3.6 3.6 3.6 0.8 1.6 1/-1 -0.3 to VCCD + 0.3 -0.3 to VCCD + 0.3 -2 to 2 125 -65 to 150 300 Unit V V V V V V V V V C C C
Absolute maximum ratings are limiting values (referenced to GND = 0V), to be applied individually, while other parameters are within specified operating conditions. Long exposure to maximum ratings may affect device reliability.
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Recommended Conditions of Use
Parameter Analog supply voltage Digital supply voltage Output supply voltage Differential analog input voltage (full-scale) Differential clock input level Internal Settling Adjustment (ISA) with a 3-wire serial interface for channel I and channel Q Operating temperature range Symbol VCCA VCCD VCCO VINi -VIniB or VINQ -VINQB Vinclk ISA TAmbient Commercial grade Industrial grade Comments Recommended Value 3.3 3.3 2.25 500 600 -50 0 < TA < 70 -40 < TA < 85 Unit V V V mVpp mVpp ps C
Electrical Operating Characteristics
Unless otherwise specified: * * * * * VCCA = 3.3V; VCCD = 3.3V; VCCO = 2.25V VINI - VINB or VINQ - VINQB = 500 mVpp full-scale differential input LVDS digital outputs (100) TA (typical) = 25 C Full temperature range: 0 C < TA < 70 C (commercial grade) or -40 C < TA < 85 C (industrial grade)
Table 1. Electrical Operating Characteristics in Nominal Conditions
Parameter Resolution Power Requirements Positive supply voltage - Analog - Digital Output digital (LVDS) and serial interface Supply current (typical conditions) - Analog - Digital - Output Supply current (1:2 DMUX mode) - Analog - Digital - Output VCCA VCCD VCCO ICCA ICCD ICCO 3.15 3.15 2.0 3.3 3.3 2.25 150 230 100 150 260 175 3.45 3.45 2.5 180 275 120 180 310 210 V V V Symbol Min Typ 8 Max Unit Bits
mA mA mA
ICCA ICCD ICCO
mA mA
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Table 1. Electrical Operating Characteristics in Nominal Conditions (Continued)
Parameter Supply current (2 input clocks, 1:2 DMUX mode) - Analog - Digital - Output Supply current (1 channel only, 1:1 DMUX mode) - Analog - Digital - Output Supply current (1 channel only, 1:2 DMUX mode) - Analog - Digital - Output Supply current (full standby mode) - Analog - Digital - Output Nominal dissipation (1 clock, 1:1 DMUX mode, 2 channels) Nominal dissipation (full standby mode) Analog Inputs Full-scale differential analog input voltage Analog input capacitance I and Q Full power input bandwidth (-3 dB) Gain flatness (-0.5 dB) Clock Input Logic compatibility for clock inputs and DDRB Reset (pins 124,125,126,127,128,129) PECL/LVDS clock inputs voltages (VCLKI/IN or VCLKQ/QN) Differential logical level Clock input power level Clock input capacitance Digital Outputs Logic compatibility for digital outputs (depending on the value of VCCO) Differential output voltage swings (assuming VCCO = 2.25V) VOD 220 LVDS 270 350 mV VIL - VIH -9 PECL/ECL/LVDS VINi - VIniB or VINQ - VINQB CIN FPBW 1.0 400 mV 450 500 550 mV 2 pF GHz MHz Symbol ICCA ICCD ICCO Min Typ 150 290 180 Max 180 350 215 Unit
mA
ICCA ICCD ICCO
80 160 55
95 190 65
mA mA mA
ICCA ICCD ICCO ICCA ICCD ICCO PD stbpd
80 170 90
95 205 110 17 34 5 1.7
mA mA mA mA mA mA W mW
12 24 3 1.4 120
600 0 2 6
mV dBm pF
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Table 1. Electrical Operating Characteristics in Nominal Conditions (Continued)
Parameter Output levels (assuming VCCO = 2.25V) 100 differentially terminated Logic 0 voltage Logic 1 voltage Output offset voltage (assuming VCCO = 2.25V) 100 differentially terminated Output impedance Output current (shorted output) Output current (grounded output) Output level drift with temperature Digital Input (Serial Interface) Maximum clock frequency (input clk) Input logical level 0 (clk, mode, data, ldn) Input logical level 1 (clk, mode, data, ldn) Output logical level 0 (cal) Output logical level 1 (cal) Maximum output load (cal) Note: Fclk -0.4 VCCO - 0.4 -0.4 VCCO - 0.4 0 VCCO - 0.4 0 VCCO 50 0.4 VCCO + 0.4 0.4 VCCO + 0.4 15 MHz V V V V pF 30 1.3 Symbol Min Typ Max Unit
VOL VOH VOS RO
1.0 1.25 1125
1.1 1.35 1250 50
1.2 1.45 1325
V V mV W
12
mA mA mV/C
The gain setting is 0 dB, one clock input, no standby mode [full power mode], 1:1 DMUX, calibration off.
Table 2. Electrical Operating Characteristics
Parameter DC Accuracy No missing code Differential non-linearity Integral non-linearity Gain error (single channel I or Q) with calibration Input offset matching (single channel I or Q) with calibration Gain error drift against temperature Gain error drift against VCCA Mean output offset code with calibration Transient Performance Bit Error Rate Fs = 1 Gsps Fin = 250 MHz ADC settling time channel I or Q (between 10% - 90% of output response) VIni -ViniB = 500 mVpp Note: BER 10-15 10-12 Error/ sample 127 DNL INL -0.5 -0.5 Guaranteed over specified temperature range 0.25 0.5 0 0 0.062 0.064 127.5 128 0.6 1 0.5 0.5 LSB LSB LSB LSB LSB/C LSB/mV LSB Symbol Min Typ Max Unit
TS
170
ps
The gain setting is 0 dB, two clock inputs, no standby mode [full power mode], 1:2 DMUX, calibration on.
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Table 3. AC Performances
Parameter AC Performance Signal-to-noise Ratio Fs = 500 Msps Fs = 500 Msps Fs = 500 Msps Fin = 20 MHz Fin = 250 MHz Fin = 500 MHz SNR 42 41 44 43 42 dBc dBc dBc Symbol Min Typ Max Unit
Effective Number of Bits Fs = 500 Msps Fs = 500 Msps Fs = 500 Msps Fin = 20 MHz Fin = 250 MHz Fin = 500 MHz ENOB 7 6.7 7.2 7.0 6.8 Bits Bits Bits
Total Harmonic Distortion (First 9 Harmonics) Fs = 500 Msps Fs = 500 Msps Fs = 500 Msps Fin = 20 MHz Fin = 250 MHz Fin = 500 MHz |THD| 48 47 54 53 51 dBc dBc dBc
Spurious Free Dynamic Range Fs = 500 Msps Fs = 500 Msps Fs = 500 Msps Fin = 20 MHz Fin = 250 MHz Fin = 500 MHz |SFDR| 50 49 56 55 54 dBc dBc dBc
Two-tone Inter-modulation Distortion (Single Channel) FIN1 = 249 MHz , FIN2 = 251 MHz at Fs = 500 Msps Phase matching using auto-calibration and FiSDA in interlace mode (channel I and Q) Fin = 250 MHz Fs = 500 Msps Crosstalk channel I versus channel Q Fin = 250 MHz, Fs = 500 Msps(2) Notes: IMD -54 dBc
d
-0.7
0
0.7
Cr
-55
dB
1. Differential input [-1 dBFS analog input level], gain setting is 0 dB, two input clock signals, no standby mode, 1:1 DMUX, ISA = -50 ps. 2. Measured on the AT84AD004TD-EB Evaluation Board.
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Table 4. AC Performances in Interlace Mode
Parameter Interlace Mode Maximum equivalent clock frequency Fint = 2 x Fs Where Fs = external clock frequency Minimum clock frequency Differential non-linearity in interlace mode Integral non-linearity in interlace mode Signal-to-noise Ratio in Interlace Mode Fint = 1 Gsps Fint = 1 Gsps Fin = 20 MHz iSNR Fin = 250 MHz 40 dBc Effective Number of Bits in Interlace Mode Fint = 1 Gsps Fint = 1 Gsps Fin = 20 MHz iENOB Fin = 250 MHz 6.8 Bits Total Harmonic Distortion in Interlace Mode Fint = 1 Gsps Fint = 1 Gsps Fin = 20 MHz |iTHD| Fin = 250 MHz 49 dBc Spurious Free Dynamic Range in Interlace Mode Fint = 1 Gsps Fint = 1 Gsps Fin = 20 MHz Fin = 250 MHz |iSFDR| 54 52 dBc dBc 52 dBc 7.1 Bits 42 dBc Fint Fint intDNL intINL 1 20 0.25 0.5 Gsps Msps LSB LSB Symbol Min Typ Max Unit
Two-tone Inter-modulation Distortion (Single Channel) in Interlace Mode FIN1 = 249 MHz , FIN2 = 251 MHz at Fint = 1 Gsps iIMD -54 dBc
Note:
One analog input on both cores, clock I samples the analog input on the rising and falling edges. The calibration phase is necessary. The gain setting is 0 dB, one input clock I, no standby mode, 1:1 DMUX, FiSDA adjustment.
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Table 5. Switching Performances
Parameter Symbol Min Typ Max Unit
Switching Performance and Characteristics - See "Timing Diagrams" on page 12. Maximum operating clock frequency Minimum clock frequency (no transparent mode) Minimum clock frequency (with transparent mode) Minimum clock pulse width [high] (No transparent mode) Minimum clock pulse width [low] (No transparent mode) Aperture delay: nominal mode with ISA & FiSDA Aperture uncertainty Data output delay between input clock and data Data Ready Output Delay Data Ready Reset to Data Ready Data Output Delay with Data Ready Data Ready (CLKO) Delay Adjust (140 ps steps) Output skew Output rise/fall time for DATA (20% - 80%) Output rise/fall time for DATA READY (20% - 80%) Data pipeline delay (nominal mode) TPD Data pipeline delay (nominal mode) in S/H transparent mode DDRB recommended pulse width 1 2.5 (port B) 3 (port A, 1:1 DMUX mode) 3.5 (port A, 1:2 DMUX mode) ns TR/TF TR/TF FS TC1 TC2 TA Jitter TDO TDR TRDR TD2 Tdrda range 50 300 300 350 350 0.4 0.4 FS 500 10 1 1 1 1 0.4 3.8 3 2 1/2 Fs +Tdrda -560 to 420 100 500 500 50 50 Msps Msps Ksps ns ns ns ps (rms) ns ns ns ps ps ps ps ps
3 (port B) 3.5 (port A, 1:1 DMUX mode) 4 (port A, 1:2 DMUX mode)
Clock cycles
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Timing Diagrams
Figure 4. Timing Diagram, ADC I or ADC Q, 1:2 DMUX Mode, Clock I for ADC I, Clock Q for ADC Q
Address: D7 D6 D5 D4 D3 D2 D1 D0 11XX1X00
TA N+3 N+1 N N+2
VIN CLKI or CLKQ
Pipeline delay = 4 clock cycles
TDO
DOIA[0:7] or DOQA[0:7] DOIB[0:7] or DOQB[0:7]
N-4
N-2
N
Pipeline delay = 3 clock cycles
N-3 N-1
TDO
N +1
TD2
Programmable delay
CLKOI or CLKOQ (= CLKI/2) CLKOI or CLKOQ (= CLKI/4)
Figure 5. 1:1 DMUX Mode, Clock I = ADC I, Clock Q = ADC Q
Address: D7 D6 D5 D4 D3 D2 D1 D0 11XX0X00
TA
N+3 N+1 N+2
VIN
N
CLKI or CLKQ
Pipeline delay = 3.5 clock cycles TDO
DOIA[0:7] or DOQA[0:7] CLKOI or CLKOQ
N -3
N -2
N-1
N
N+1
DOIB[0:7] and DOQB[0:7] are high impedance
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Figure 6. 1:2 DMUX Mode, Clock I = ADC I, Clock I = ADC Q
Address: D7 D6 D5 D4 D3 D2 D1 D0 10XX1X00
TA N+3 N+1 N N+2
VIN CLKI
Pipeline delay = 4 clock cycles
TDO
NI
DOIA[0:7]
NI - 4
NI - 2
Pipeline delay = 3 clock cycles
TDO
NI +1
DOIB[0:7] DOQA[0:7]
NI - 3
NI - 1
NQ - 4
NQ - 2
NQ
DOQB[0:7]
NQ - 3
NQ - 1
NQ +1
TD2
CLKOI (= CLKI/2) CLKOI (= CLKI/4) CLKOQ is high impedance
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Figure 7. 1:1 DMUX Mode, Clock I = ADC I, Clock I = ADC Q
Address: D7 D6 D5 D4 D3 D2 D1 D0 10XX0X00
TA N+3
VIN
N
N+1
N+2
CLKI
Pipeline delay = 3.5 clock cycles TDO
DOIA[0:7]
N -3
N -2
N-1
N
N+1
DOQA[0:7] CLKOI
N -3
N -2
N-1
N
N+1
DOIB[0:7] and DOQB[0:7] are high impedance CLKOQ is high impedance
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Figure 8. 1:2 DMUX Mode, Clock I = ADC I, Clock IN = ADC Q
Address: D7 D6 D5 D4 D3 D2 D1 D0 0XXX1X00
TA N+2 N+1 N+3 N+4 N+5 N+6
VIN
N
CLKI CLKIN
Pipeline delay = 4 clock cycles TDO
DOQA[0:7]
N -8
N-4
N
Pipeline delay = 3 clock cycles
TDO
N+2
DOQB[0:7]
N -6
N -2
Pipeline delay = 3.5 clock cycles
TDO
N+1
DOIA[0:7]
N -7
N-3
DOIB[0:7]
N -5
N -1
N+3
TD2
CLKOI (= CLKI/2) CLKOI (= CLKI/4) CLKOQ is high impedance
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Figure 9. 1:1 DMUX Mode, Clock I = ADC I, Clock IN = ADC Q
Address: D7 D6 D5 D4 D3 D2 D1 D0 0XXX0X00
TA
N+2
N+4
N+5
N+6
VIN
N
N+1
N+3
CLKI
CLKIN
Pipeline delay = 3.5 clock cycles TDO
N-2
N N+2
DOQA[0:7]
N -6
N -4
Pipeline delay = 3 clock cycles
TDO
N-1
N +1 N+3
DOIA[0:7]
N -5
N -3
CLKOI (= CLKI/2)
DOIB[0:7] and DOQB[0:7] are high impedance CLKOQ is high impedance
Figure 10. 1:1 DMUX Mode, Decimation Mode Test (1:16 Factor)
Address: D7 D6 D5 D4 D3 D2 D1 D0 10XX0X00
N - 16 N N + 32
N + 16
VIN
16 clock cycles
CLKI
DOIA[0:7] DOQA[0:7]
N - 16
N
N + 16
N + 32
N + 48
N - 16
N
N + 16
N + 32
N + 48
CLKOI
DOIB[0:7] and DOQB[0:7] are high impedance CLKOQ is high impedance
Notes:
1. Frequency(CLKOI) = Frequency(Data) = Frequency(CLKI)/16.
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Figure 11. Data Ready Reset
500 ps 500 ps
CLKI or CLKQ DDRB
1 ns min
FORBIDDEN ALLOWED
FORBIDDEN ALLOWED
Figure 12. Data Ready Reset 1:1 DMUX Mode
TA
VIN
Clock in Reset
N
N+1
CLKI or CLKQ DOIA[0:7] or DOQA[0:7]
Pipeline Delay + TDO N TDR
CLKOI or CLKOQ
TDR
2 ns
DDRB
1 ns min
Note:
The Data Ready Reset is taken into account only 2 ns after it is asserted. The output clock first completes its cycle (if the reset occurs when it is high, it goes low only when its half cycle is complete; if the reset occurs when it is low, it remains low) and then only, remains in reset state (frozen to a low level in 1:1 DMUX mode). The next falling edge of the input clock after reset makes the output clock return to normal mode (after TDR).
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Figure 13. Data Ready Reset 1:2 DMUX Mode
TA
VIN
Clock in Reset
N
N+1
CLKI or CLKQ
Pipeline Delay + TDO
DOIA[0:7] or DOQA[0:7] DOIB[0:7] or DOQB[0:7]
TDR
N
N+1
CLKOI or CLKOQ (= CLKI/2)
TDR
TDR + 2 cycles
CLKOI or CLKOQ (= CLKI/4)
TDR + 2 cycles
2 ns
DDRB
1 ns min
Notes:
1. In 1:2 DMUX, Fs/2 mode: The Data Ready Reset is taken into account only 2 ns after it is asserted. The output clock first completes its cycle (if the reset occurs when it is low, it goes high only when its half cycle is complete; if the reset occurs when it is high, it remains high) and then only, remains in reset state (frozen to a high level in 1:2 DMUX Fs/2 mode). The next rising edge of the input clock after reset makes the output clock return to normal mode (after TDR). 2. In 1:2 DMUX, Fs/4 mode: The Data Ready Reset is taken into account only 2 ns after it is asserted. The output clock first completes its cycle (if the reset occurs when it is high, it goes low only when its half cycle is complete; if the reset occurs when it is low, it remains low) and then only, remains in reset state (frozen to a low level in 1:2 DMUX Fs/4 mode). The next rising edge of the input clock after reset makes the output clock return to normal mode (after TDR).
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Functions Description
Table 6. Description of Functions
Name VCCA VCCD VCCO GNDA GNDD GNDO VINI, VINIB VINQ, VINQB CLKOI, CLKOIN, CLKOQ, CLKOQN CLKI, CLKIN, CLKQ, CLKQN DDRB, DDRBN Mode Clk Data Ldn DOIRI, DOIRIN DOIRQ, DOIRQN VtestQ VtestI Cal Vdiode Function Positive analog power supply Positive digital power supply Positive output power supply Analog ground Digital ground Output ground Differential analog inputs I Differential analog inputs Q Differential output data ready I and Q Differential clock inputs I and Q Synchronous data ready reset I and Q Bit selection for 3-wire bus or nominal setting Input clock for 3-wire bus interface Input data for 3-wire bus Beginning and end of register line for 3-wire bus interface Differential output data port channel I
GNDA GNDD GNDO mode clk data ldn VINI VINIB VINQ 32 VINQB CLKI 32 D0AI0 D0AI0N D0BI0 D0BI0N D0AQ0 D0AQ0 DOAI7 DOAI7N DOBI7 DOBI7N DOAQ7 DOAQ7 VCCA = 3.3V VCCD = 3.3V VCCO = 2.25V
DOBQ0 DOQBQ7 DOBQ0N DOQBQ7N
AT84AD004
4 DOIRI, DOIRIN DOIRQ, DOIRQN CLOCKOI, CLOCKOIB CLOCKOQ, CLOCKOQB VtestI VtestQ Vdiode
CLKIB CLKQ 4
CLKQB
2
Differential output data port channel Q Differential output IN range data I and Q Test voltage output for ADC Q (to be left open) Test voltage output for ADC I (to be left open) Output bit status internal calibration Test diode voltage for Tj measurement
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Digital Output Coding (Nominal Settings)
Table 7. Digital Output Coding (Nominal Setting)
Differential Analog Input > 250 mV 250 mV 248 mV 1 mV -1 mV -248 mV -250 mV < -250 mV Voltage Level > Positive full-scale + 1/2 LSB Positive full-scale + 1/2 LSB Positive full-scale - 1/2 LSB Bipolar zero + 1/2 LSB Bipolar zero - 1/2 LSB Negative full-scale + 1/2 LSB Negative full-scale - 1/2 LSB < Negative full-scale - 1/2 LSB Digital Output I or Q (Binary Coding) 11111111 11111111 11111110 10000000 01111111 00000001 00000000 00000000 Out-of-range Bit 1 0 0 0 0 0 0 1
Pin Description
Table 8. AT84AD004 LQFP 144 Pin Description
Symbol GNDA, GNDD, GNDO VCCA VCCD VCCO Pin number 10, 12, 22, 24, 36, 38, 40, 42, 44, 46, 51, 54, 59, 61, 63, 65, 67, 69, 85, 87, 97, 99, 109, 111, 130, 142, 144 41, 43, 45, 60, 62, 64 9, 21, 37, 39, 66, 68, 88, 100, 112, 123, 141 11, 23, 86, 98, 110, 143 Function Ground pins. To be connected to external ground plane Analog positive supply: 3.3V typical 3.3V digital supply 2.25V output and 3-wire serial interface supply In-phase (+) analog input signal of the sample & hold differential preamplifier channel I Inverted phase (-) of analog input signal (VINI) In-phase (+) analog input signal of the sample & hold differential preamplifier channel Q Inverted phase (-) of analog input signal (VINQ) In-phase (+) clock input signal Inverted phase (-) clock input signal (CLKI) In-phase (+) clock input signal
VINI
57, 58
VINIB
55, 56
VINQ
47, 48
VINQB CLKI CLKIN CLKQ
49, 50 124 125 129
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Table 8. AT84AD004 LQFP 144 Pin Description (Continued)
Symbol CLKQN DDRB DDRBN DOAI0, DOAI1, DOAI2, DOAI3, DOAI4, DOAI5, DOAI6, DOAI7 DOAI0N, DOAI1N, DOAI2N, DOAI3N, DOAI4N, DOAI5N, DOAI6N, DOAI7N, DOBI0, DOBI1, DOBI2, DOBI3, DOBI4, DOBI5, DOBI6, DOBI7 DOBI0N, DOBI1N, DOBI2N, DOBI3N, DOBI4N, DOBI5N, DOBI6N, DOBI7N DOAQ0, DOAQ1, DOAQ2, DOAQ3, DOAQ4, DOAQ5, DOAQ6, DOAQ7 DOAQ0N, DOAQ1N, DOAQ2N, DOAQ3N, DOAQ4N, DOAQ5N, DOAQ6N, DOAQ7N DOBQ0, DOBQ1, DOBQ2, DOBQ3, DOBQ4, DOBQ5, DOBQ6, DOBQ7 DOBQ0N, DOBQ1N, DOBQ2N, DOBQ3N, DOBQ4N, DOBQ5N, DOBQ6N, DOBQ7N Pin number 128 126 127 117, 113, 105, 101, 93, 89, 81, 77 Function Inverted phase (-) clock input signal (CLKQ) Synchronous data ready reset I and Q Inverted phase (-) of input signal (DDRB) In-phase (+) digital outputs first phase demultiplexer (channel I) DOAI0 is the LSB. D0AI7 is the MSB Inverted phase (-) digital outputs first phase demultiplexer (channel I) DOAI0N is the LSB. D0AI7N is the MSB In-phase (+) digital outputs second phase demultiplexer (channel I) DOBI0 is the LSB. D0BI7 is the MSB Inverted phase (-) digital outputs second phase demultiplexer (channel I) DOBI0N is the LSB. D0BI7N is the MSB In-phase (+) digital outputs first phase demultiplexer (channel Q) DOAI0 is the LSB. D0AQ7 is the MSB Inverted phase (-) digital outputs first phase demultiplexer (channel Q) DOAI0N is the LSB. D0AQ7N is the MSB In-phase (+) digital outputs second phase demultiplexer (channel Q) DOBQ0 is the LSB. D0BQ7 is the MSB Inverted phase (-) digital outputs second phase demultiplexer (channel Q) DOBQ0N is the LSB. D0BQ7N is the MSB In-phase (+) out-of-range bit input (I phase) combined demultiplexer out-of-range is high on the leading edge of code 0 and code 256 Inverted phase of output signal DOIRI In-phase (+) out-of-range bit input (Q phase) combined demultiplexer out-of-range is high on the leading edge of code 0 and code 256 Inverted phase of output signal DOIRQ Bit selection for 3-wire bus interface or nominal setting Input clock for 3-wire bus interface Input data for 3-wire bus Beginning and end of register line for 3- wire bus interface Output clock in-phase (+) channel I
118, 114, 106, 102, 94, 90, 82, 78
119, 115, 107, 103, 95, 91, 83, 79
120, 116, 108, 104, 96, 92, 84, 80
136, 140, 4, 8, 16, 20, 28, 32
135, 139, 3, 7, 15, 19, 27, 31
134, 138, 2, 6, 14, 18, 26, 30
133, 137, 1 ,5, 13, 17, 25, 29
DOIRI
75
DOIRIN
76
DOIRQ
34
DOIRQN MODE CLK DATA LND CLKOI
33 74 73 72 71 121
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Table 8. AT84AD004 LQFP 144 Pin Description (Continued)
Symbol CLKOIN CLKOQ CLKOQN VtestQ, VtestI Cal Vdiode Pin number 122 132 131 52, 53 70 35 Function Inverted phase (-) output clock channel I Output clock in-phase (+) channel Q, 1/2 input clock frequency Inverted phase (-) output clock channel Q Pins for internal test (to be left open) Calibration output bit status Positive node of diode used for die junction temperature measurements
Figure 14. AT84AD004 Pinout (Top View)
LQFP 144 20 by 20 by 1.4 mm Atmel - Dual 8-bit
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Typical Characterization Results
Nominal conditions (unless otherwise specified): * * * * * VCCA = 3.3V; VCCD = 3.3V; VCCO = 2.25V VINI - VINB or VINQ to VINQB = 500 mVpp full-scale differential input LVDS digital outputs (100) TA (typical) = 25 C Full temperature range: 0C < TA < 70C (commercial grade) or -40C < TA < 85 C (industrial grade) Fs = 500 Msps Pclock = 0 dBm Pin = -1 dBFS Gain flatness (5 dB) from DC to > 400 MHz Full power input bandwidth at -3 dB > 1 GHz
Typical Full Power Input Bandwidth
* * * * *
Figure 15. Full Power Input Bandwidth
0 -1 -2 Gain Flatness -3 dB Bandwidth -3 -4 -5 -6 -7 250
dBFS
500
750 Fin (MHz)
1000
1250
1500
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Typical Crosstalk
Figure 16. Crosstalk (Fs = 500 Msps)
80 70 60 50
dBc
40 30 20 10 0 0 100 200 300 400 500 Fin (MHz) 600 700 800 900 1000
Note:
Measured on the AT84AD004TD-EB Evaluation Board.
Typical DC, INL and DNL Patterns
1:2 DMUX mode, Fs/4 DR type Figure 17. Typical INL (Fs = 50 Msps, Fin = 1 MHz, Saturated Input)
0,6
0,4
0,2
INL (Lsb)
0
-0,2
-0,4
-0,6 1 16 31 46 61 76 91 106 121 136 151 166 181 196 211 226 241 256 Codes
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Figure 18. Typical DNL (Fs = 50 Msps, Fin = 1 MHz, Saturated Input)
0.3
0.2
0.1
DNL (Lsb)
0
-0.1
-0.2
-0.3 1 16 31 46 61 76 91 106 121 136 151 166 181 196 211 226 241 256 Codes
Typical Dynamic Performances Versus Sampling Frequency
Figure 19. ENOB Versus Sampling Frequency in Nyquist Conditions (Fin = Fs/2)
7.6 7.4 7.2
ENOB (Bit)
7.0 6.8 6.6 6.4 6.2 6.0 50 100 150 200 250 300 Fs (Msps) 350 400 450 500 550
Figure 20. SFDR Versus Sampling Frequency in Nyquist Conditions (Fin = Fs/2)
-56
SFDR (dBc)
-59
-62
-65
-68 50 100 150 200 250 300 Fs (Msps) 350 400 450 500 550
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Figure 21. THD Versus Sampling Frequency in Nyquist Conditions (Fin = Fs/2)
-48
-50
-52
THD (dBc)
-54
-56
-58
-60 50 100 150 200 250 300 Fs (Msps) 350 400 450 500 550
Figure 22. SNR Versus Sampling Frequency in Nyquist Conditions (Fin = Fs/2)
45
44
SNR (dBc)
43
42
41
40 50 100 150 200 250 300 Fs (Msps 350 400 450 500 550
Typical Dynamic Performances Versus Input Frequency
Figure 23. ENOB Versus Input Frequency (Fs = 500 Msps)
7.6 7.4 7.2
ENOB (Bit)
7.0 6.8 6.6 6.4 6.2 0 100 200 Fin (MHz) Channel I Channel Q 300 400 500
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Figure 24. SFDR Versus Input Frequency (Fs = 500 Msps)
-46 -48 -50 -52
SFDR (dBc)
-54 -56 -58 -60 -62 -64 0 100 200 Fin (MHz) Channel I Channel Q 300 400 500
Figure 25. THD Versus Input Frequency (Fs = 500 Msps)
-48 -49 -50 -51
THD (dBc)
-52 -53 -54 -55 -56 -57 -58 0 100 200 Fin (MHz) Channel I Channel Q 300 400 500
Figure 26. SNR Versus Input Frequency (Fs = 500 Msps)
45
44
SNR (dBc)
43
42
41
40 0 100 200 Fin (MHz) Channel I Channel Q 300 400 500
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Typical Signal Spectrum
Figure 27. Fs = 500 Msps and Fin = 20 MHz (1:2 DMUX, Fs/4 DR Type FiSDA = -35 ps, ISA = -50 ps)
20 Fundamental: H1
0
-20 SFDR = -60 dBc -40
dBc
H2 -60
H3
H4
-80
-100
-120 0 16 31 47 63 78 94 109 125 141 156 172 188 203 219 234 Fs (Msps)
Figure 28. Fs = 500 Msps and Fin = 250 MHz (1:2 DMUX, Fs/4 DR Type FiSDA = -35 ps, ISA = -50 ps)
20 Fundamental : H1 0
-20 SFDR = -58 dBc -40
dBc
H3 -60
H2
-80
-100
-120 0 16 31 47 63 78 94 109 125 141 156 172 188 203 219 234 Fs (Msps)
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Figure 29. Fs = 500 Msps and Fin = 500 MHz (1:2 DMUX, Fs/4 DR Type FiSDA = -35 ps, ISA = -50 ps)
20 Fundamental: H1 0
-20 H2 -40
dBc
SFDR = -57 dBc H3
-60
-80
-100
-120 0 16 31 47 63 78 94 109 125 141 156 172 188 203 219 234 Fs (Msps)
Note:
The spectra are given with respect to the output clock frequency observed by the acquisition system (Figures 27 to 29).
Figure 30. Fs = 500 Msps and Fin = 250 MHz (Interleaving Mode Fint = 1 Gsps 1:1 DMUX, FiSDA = -35 ps, ISA = -50 ps)
20 Fundamental: H1 0 -20 SFDR = -53 dBc -40
dBc
-60 -80 -100 -120 0 62 125 187 249 Fs (Msps) 311 374 436 498 Fs
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Typical Performance Sensitivity Versus Power Supplies and Temperature
Figure 31. ENOB Versus VCCA (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
7.6
7.4
ENOB (Bit)
7.2
7.0
6.8
6.6 3.1 3.15 3.2 3.25 3.3 Vcca (V) 3.35 3.4 3.45 3.5
Channel I
Channel Q
Figure 32. SFDR Versus VCCA (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
-48 -50 -52
SFDR (dBc)
-54 -56 -58 -60 -62 3.1 3.15 3.2 3.25 Channel I 3.3 Vcca (V) Channel Q 3.35 3.4 3.45 3.5
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Figure 33. THD Versus VCCA (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
-48 -49 -50 -51
THD (dBc)
-52 -53 -54 -55 -56 -57 -58 3.1 3.15 3.2 3.25 3.3 Vcca (V) Channel I Channel Q 3.35 3.4 3.45 3.5
Figure 34. SNR Versus VCCA (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
46.0
45.0
SNR (dBc)
44.0
43.0
42.0
41.0 3.1 3.15 3.2 3.25 3.3 Vcca (V) Channel I Channel Q 3.35 3.4 3.45 3.5
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Figure 35. ENOB Versus Junction Temperature (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
7.4 7.2 7.0
500 Msps 20 MHz 500 Msps 250 MHz 500 Msps 500 MHz
ENOB (Bit)
6.8 6.6 6.4 6.2 6.0 -50 -25 0 25 Tj (C) 50 75
100
Figure 36. SFDR Versus Junction Temperature (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
-46 -48 -50 -52 -54 -56 -58 -60 -62 -50 -25 0 25 Tj (C) 50 75 100 500 Msps 20 MHz 500 Msps 500 MHz 500 Msps 250 MHz
SFDR (dBc)
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Figure 37. THD Versus Junction Temperature (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
-44 -46 -48
THD (dBc)
500 Msps 500 MHz 500 Msps 250 MHz 500 Msps 20 MHz
-50 -52 -54 -56 -58 -50 -25 0 25 Tj (C) 50 75
100
Figure 38. SNR Versus Junction Temperature (Fs = 500 Msps, Fin = 250 MHz, 1:2 DMUX, Fs/4 DR Type, ISA = -50 ps)
46
45 500 Msps 20 MHz
44
SNR (dBc)
43
500 Msps 250 MHz 500 Msps 500 MHz
42
41
40 -50 -25 0 25 Tj (C) 50 75 100
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Test and Control Features
3-wire Serial Interface Control Setting
Table 9. 3-wire Serial Interface Control Settings
Mode Mode = 1 (2.25V) Characteristics 3-wire serial bus interface activated 3-wire serial bus interface deactivated Nominal setting: Dual channel I and Q activated One clock I 0 dB gain DMUX mode 1:1 DRDA I & Q = 0 ps ISA I & Q = 0 ps FiSDA Q = 0 ps Binary output Decimation test mode OFF Calibration setting OFF Data Ready = Fs /2
Mode = 0 (0V)
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3-wire Serial Interface and Data Description The 3-wire bus is activated with the control bit mode set to 1. The length of the word is 19 bits: 16 for the data and 3 for the address. The maximum clock frequency is 50 MHz.
Table 10. 3-wire Serial Interface Address Setting Description
Address Setting Standby Gray/binary mode 1:1 or 1:2 DMUX mode Analog input MUX Clock selection Auto-calibration Decimation test mode Data Ready Delay Adjust Analog gain adjustment Data7 to Data0: gain channel I Data15 to Data8: gain channel Q Code 00000000: -1.5 dB Code 10000000: 0 dB Code 11111111: 1.5 dB Steps: 0.011 dB Offset compensation Data7 to Data0: offset channel I Data15 to Data8: offset channel Q Data7 and Data15: sign bits Code 11111111b: 31.75 LSB Code 10000000b: 0 LSB Code 00000000b: 0 LSB Code 01111111b: -31.75 LSB Steps: 0.25 LSB Maximum correction: 31.75 LSB Gain compensation Data6 to Data0: channel I/Q (Q is matched to I) Code 11111111b: -0.315 dB Code 10000000b: 0 dB Code 0000000b: 0 dB Code 0111111b: 0.315 dB Steps: 0.005 dB Data6: sign bit Internal Settling Adjustment (ISA) Data2 to Data0: channel I Data5 to Data3: channel Q Data15 to Data6: 1000010000
000
001
010
011
100
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Table 10. 3-wire Serial Interface Address Setting Description (Continued)
Address Setting Testability Data3 to Data0 = 0000 Mode S/H transparent OFF: Data4 = 0 ON: Data4 = 1 Data7 = 0 Data8 = 0 Built-In Test (BIT) Data0 = 0 BIT Inactive Data0 = 1 BIT Active Data1 = 0 Static BIT Data1 = 1 Dynamic BIT If Data1 = 1, then Ports BI & BQ = Rising Ramp Ports AI & AQ = Decreasing Ramp If Data1 = 0, then Data2 to Data9 = Static Data for BIT Ports BI & BQ = Data2 to Data9 Ports AI & AQ = NOT (Data2 to Data9) Data Ready Delay Adjust (DRDA) Data2 to Data0: clock I Data5 to Data3: clock Q Steps: 140 ps 000: -560 ps 100: 0 ps 111: 420 ps Fine Sampling Delay Adjustment (FiSDA) on channel Q Data10 to Data6: channel Q Steps: 5 ps Data4: sign bit Code 11111: -75 ps Code 10000: 0 ps Code 00000: 0 ps Code 01111: 75 ps 1. The Internal Settling Adjustment could change independently of the two analog sampling times (TA channels I and Q) of the sample/hold (with a fixed digital sampling time) with steps of 50 ps: Nominal mode will be given by Data2...Data0 = 100 or Data5...Data3 = 100. Data5...Data3 = 000 or Data2...Data0 = 000: sampling time is -200 ps compared to nominal. Data2...Data0 = 111 or Data5...Data3 = 111: sampling time is 150 ps compared to nominal. We recommend setting the ISA to -50 ps to optimize the ADC's dynamic performances. 2. The Fine Sampling Delay Adjustment enables you to change the sampling time (steps of 5 ps) on channel Q more precisely, particularly in the interleaved mode. 3. The "S/H transparent" mode (address 101, Data4) enables bypassing of the ADC's track/hold. This function optimizes the ADC's performances at very low input frequencies (Fin < 50 MHz). 4. In the Gray mode, when the input signal is overflow (that is, the differential analog input is greater than 250 mV), the output data must be corrected using the output DOIR: If DOIR = 1: Data7 unchanged Data6 = 0, Data5 = 0, Data4 = 0, Data3 = 0, Data2 = 0, Data1 = 0, Data0 = 0. In 1:2 DMUX mode, only one out-of-range bit is provided for both A and B ports.
101
110
111
Notes:
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Table 11. 3-wire Serial Interface Data Setting Description
Setting for Address: 000 D15 D14 D13 D12 D11 D10 D9(1) D8 D7 D6 D5 D4 D3 D2 D1 D0
Full standby mode Standby channel I
(2) (3)
X X X X X X X X X
X X X X X X X X X
X X X X X X X X X
X X X X X X X X X
X X X X X X X X X
X X X X X X X X X
0 0 0 0 0 0 0 0 0
X X X X X X X X X
X X X X X X X X X
X X X X X X X X X
X X X X X X X X 1
X X X X X X X X 1
X X X X X X 1 0 X
X X X X 1 0 X X X
1 0 1 0 X X X X X
1 1 0 0 X X X X X
Standby channel Q No standby mode
Binary output mode Gray output mode DMUX 1:2 mode DMUX 1:1 mode Analog selection mode Input I ADC I Input Q ADC Q Analog selection mode Input I ADC I Input I ADC Q Analog selection mode Input Q ADC I Input Q ADC Q Clock Selection mode CLKI ADC I CLKQ ADC Q Clock selection mode CLKI ADC I CLKI ADC Q Clock selection mode CLKI ADC I CLKIN ADC Q Decimation OFF mode Decimation ON mode Keep last calibration calculated value(4) No calibration phase No calibration phase(5) No calibration value Start a new calibration phase
X
X
X
X
X
X
0
X
X
X
1
0
X
X
X
X
X
X
X
X
X
X
0
X
X
X
0
X
X
X
X
X
X
X
X
X
X
X
0
X
1
1
X
X
X
X
X
X
X
X
X
X
X
X
0
X
1
0
X
X
X
X
X
X
X X X X
X X X X
X X X X
X X X X
X X X 0
X X X 1
0 0 0 0
X 0 1 X
0 X X X
X X X X
X X X X
X X X X
X X X X
X X X X
X X X X
X X X X
X X
X X
X X
X X
0 1
0 1
0 0
X X
X X
X X
X X
X X
X X
X X
X X
X X
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Table 11. 3-wire Serial Interface Data Setting Description (Continued)
Setting for Address: 000 Control wait bit calibration(6) In 1:2 DMUX FDataReady I & Q = Fs/2 In 1:2 DMUX FDataReady I & Q = Fs/4 Notes: 1. 2. 3. 4. D15 X D14 X D13 a D12 b D11 X D10 X D9(1) 0 D8 X D7 X D6 X D5 X D4 X D3 X D2 X D1 X D0 X
X
0
X
X
X
X
0
X
X
X
X
X
X
X
X
X
X
1
X
X
X
X
0
X
X
X
X
X
X
X
X
X
D9 must be set to "0" Mode standby channel I: use analog input I Vini, Vinib and Clocki. Mode standby channel Q: use analog input Q Vinq, Vinqb and Clockq. Keep last calibration calculated value - no calibration phase: D11 = 0 and D10 = 1. No new calibration is required. The values taken into account for the gain and offset are either from the last calibration phase or are default values (reset values). 5. No calibration phase - no calibration value: D11 = 0 and D10 = 0. No new calibration phase is required. The gain and offset compensation functions can be accessed externally by writing in the registers at address 010 for the offset compensation and at address 011 for the gain compensation. 6. The control wait bit gives the possibility to change the internal setting for the auto-calibration phase: For high clock rates (= 500 Msps) use a = b = 1. For clock rates > 250 Msps and < 500 Msps use a = 1 and b = 0. For clock rates > 125 Msps and < 250 Msps use a = 0 and b = 1. For low clock rates < 125 Msps use a = 0 and b = 0.
3-wire Serial Interface Timing Description
The 3-wire serial interface is a synchronous write-only serial interface made of three wires: * * * sclk: serial clock input sldn: serial load enable input sdata: serial data input
The 3-wire serial interface gives write-only access to as many as 8 different internal registers of up to 16 bits each. The input format is always fixed with 3 bits of register address followed by 16 bits of data. The data and address are entered with the Most Significant Bit (MSB) first. The write procedure is fully synchronous with the rising clock edge of "sclk" and described in the write chronogram (Figure 39 on page 39). * * * * * * * "sldn" and "sdata" are sampled on each rising clock edge of "sclk" (clock cycle). "sldn" must be set to 1 when no write procedure is performed. A minimum of one rising clock edge (clock cycle) with "sldn" at 1 is required for a correct start of the write procedure. A write starts on the first clock cycle with "sldn" at 0. "sldn" must stay at 0 during the complete write procedure. During the first 3 clock cycles with "sldn" at 0, 3 bits of the register address from MSB (a[2]) to LSB (a[0]) are entered. During the next 16 clock cycles with "sldn" at 0, 16 bits of data from MSB (d[15]) to LSB (d[0]) are entered. An additional clock cycle with "sldn" at 0 is required for parallel transfer of the serial data d[15:0] into the addressed register with address a[2:0]. This yields 20 clock cycles with "sldn" at 0 for a normal write procedure.
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* A minimum of one clock cycle with "sldn" returned at 1 is requested to close the write procedure and make the interface ready for a new write procedure. Any clock cycle where "sldn" is at 1 before the write procedure is completed interrupts this procedure and no further data transfer to the internal registers is performed. Additional clock cycles with "sldn" at 0 after the parallel data transfer to the register (done at the 20th consecutive clock cycle with "sldn" at 0) do not affect the write procedure and are ignored.
*
It is possible to have only one clock cycle with "sldn" at 1 between two following write procedures. * 16 bits of data must always be entered even if the internal addressed register has less than 16 bits. Unused bits (usually MSBs) are ignored. Bit signification and bit positions for the internal registers are detailed in Table 10 on page 35.
To reset the registers, the Pin mode can be used as a reset pin for chip initialization, even when the 3-wire serial interface is used. Figure 39. Write Chronogram
Mode
1 2 3 4 5 13 14 15 16 17 18 19 20
sclk sldn sdata Internal register value Reset setting
a[2] a[1] a[0] d[15] d[8] d[7] d[6] d[5] d[4] d[3] d[2] d[1] d[0]
New d
Reset
Write procedure
Figure 40. Timing Definition
Twlmode Mode Tsclk Tdmode sclk Tssldn sldn Tssdata sdata Thsdata Thsldn Twsclk Tdmode
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Table 12. Timing Description
Value Name Tsclk Twsclk Tssldn Thsldn Tssdata Thsdata Twlmode Tdmode Parameter Min Sclk period High or low time of sclk Setup time of sldn before rising edge of sclk Hold time of sldn after rising edge of sclk Setup time of sdata before rising edge of sclk Hold time of sdata after rising edge of sclk Minimum low pulse width of mode Minimum delay between an edge of mode and the rising edge of sclk 20 5 4 2 4 2 5 10 Typ Max ns ns ns ns ns ns ns ns Unit
Calibration Description
The AT84AD004 offers the possibility of reducing offset and gain matching between the two ADC cores. An internal digital calibration may start right after the 3-wire serial interface has been loaded (using data D12 of the 3-wire serial interface with address 000). The beginning of calibration disables the two ADCs and a standard data acquisition is performed. The output bit CAL goes to a high level during the entire calibration phase. When this bit returns to a low level, the two ADCs are calibrated with offset and gain and can be used again for a standard data acquisition. If only one channel is selected (I or Q) the offset calibration duration is divided by two and no gain calibration between the two channels is necessary. Figure 41. Internal Timing Calibration
3-wire Serial Interface LDN
CAL
Tcal
The Tcal duration is a multiple of the clock frequency ClockI (master clock). Even if a dual clock scheme is used during calibration, ClockQ will not be used. The control wait bits (D13 and D14) give the possibility of changing the calibration's setting depending on the clock's frequency: * * * * For high clock rates (= 500 Msps) use a = b = 1, Tcal = 10112 clock I periods. For clock rates > 250 Msps and < 500 Msps use a = 1, b = 0, Tcal = 6016 clock I periods. For clock rates > 125 Msps and < 250 Msps use a = 0, b = 1 ,Tcal = 3968 clock I periods. For low clock rates (< 125 Msps) use a = 0, b = 0 , Tcal = 2944 clock I periods.
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The calibration phase is necessary when using the AT84AD004 in interlace mode, where one analog input is sampled at both ADC cores on the common input clock's rising and falling edges. This operation is equivalent to converting the analog signal at twice the clock frequency
Table 13. Matching Between Channels
Value Parameter Min Gain error (single channel I or Q) without calibration Gain error (single channel I or Q) with calibration Offset error (single channel I or Q) without calibration Offset error (single channel I or Q) with calibration Mean offset code without calibration (single channel I or Q) Mean offset code with calibration (single channel I or Q) 127 -0.5 -0.5 Typ 0 0 0 0 127.5 127.5 128 0.5 0.5 Max Unit LSB LSB LSB LSB
During the ADC's auto-calibration phase, the dual ADC is set with the following: * * * Decimation mode ON 1:1 DMUX mode Binary mode
Any external action applied to any signal of the ADC's registers is inhibited during the calibration phase. Gain and Offset Compensation Functions It is also possible for the user to have external access to the ADC's gain and offset compensation functions: * * Offset compensation between I and Q channels (at address 010) Gain compensation between I and Q channels (at address 011)
To obtain manual access to these two functions, which are used to set the offset to middle code 127.5 and to match the gain of channel Q with that of channel I (if only one channel is used, the gain compensation does not apply), it is necessary to set the ADC to "manual" mode by writing 0 at bits D11 and D10 of address 000. Built-in Test (BIT) A Built-in Test (BIT) function is available to allow rapid testing of the device's I/O by either applying a defined static pattern to the ADC or by generating a dynamic ramp at the ADC's output. This function is controlled via the 3-wire bus interface at address 101. * * * The BIT is active when Data0 = 1 at address 110. The BIT is inactive when Data0 = 0 at address 110. The Data1 bit allows choosing between static mode (Data1 = 0) and dynamic mode (Data1 = 1).
When the static BIT is selected (Data1 = 0), it is possible to write any 8-bit pattern by defining the Data9 to Data2 bits. Port B then outputs an 8-bit pattern equal to Data9 ... Data2, and Port A outputs an 8-bit pattern equal to NOT (Data9 ... Data2).
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Example: Address = 110 Data =
D15 X D14 X D13 X D12 X D11 X D10 X D9 0 D8 1 D7 0 D6 1 D5 0 D4 1 D3 0 D2 1 D1 0 D0 1
One should then obtain 01010101 on Port B and 10101010 on Port A. When the dynamic mode is chosen (Data1 = 1) port B outputs a rising ramp while Port A outputs a decreasing one.
Note: In dynamic mode, use the DRDA function to align the edges of CLKO with the middle of the data.
Decimation Mode
The decimation mode is provided to enable rapid testing of the ADC. In decimation mode, one data out of 16 is output, thus leading to a maximum output rate of 31.25 Msps.
Note: Frequency (CLKO) = frequency (Data) = Frequency (CLKI)/16.
Die Junction Temperature Monitoring Function
A die junction temperature measurement setting is included on the board for junction temperature monitoring. The measurement method forces a 1 mA current into a diode-mounted transistor. Caution should be given to respecting the polarity of the current. In any case, one should make sure the maximum voltage compliance of the current source is limited to a maximum of 1V or use a resistor serial-mounted with the current source to avoid damaging the transistor device (this may occur if the current source is reverse-connected). The measurement setup is illustrated in Figure 42. Figure 42. Die Junction Temperature Monitoring Setup
VDiode (Pin 35)
1 mA
GNDD (Pin 36)
Protection Diodes
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The VBE diode's forward voltage in relation to the junction temperature (in steady-state conditions) is shown in Figure 43. Figure 43. Diode Characteristics Versus TJ
860 840 820 800
Diode Voltage (mV)
780 760 740 720 700 680 660 640 620 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120
Junction Temperature (C)
VtestI, VtestQ
VtestI and VtestQ pins are for internal test use only. These two signals must be left open.
Equivalent Input/Output Schematics
Figure 44. Simplified Input Clock Model
VCCD
CLK
50 VCCD/2 50
100 100
CLKB
GNDD
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Figure 45. Simplified Data Ready Reset Buffer Model
VCCD
DDRB
50 VCCD/2 50
100 100
DDRBN
GNDD
Figure 46. Analog Input Model
Vcca
Vcca
DC Coupling
(Common Mode = Ground = 0V)
50 GND VinI
Vinl Reverse Termination
ESD
Sel Input I
VinI Double Pad ESD VinQ Reverse Termination
GND - 0.4V MAX
GND
50 GND VinQ
GND
VinQ Double Pad
Sel Input Q
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Figure 47. Data Output Buffer Model
VCCO
DOAIO, DOAI7 DOBIO, DOBI7 DOAION, DOAI7N DOBION, DOBI7N
GNDO
Definitions of Terms
Table 14. Definitions of Terms
Abbreviation BER Definition Bit Error Rate Description The probability of exceeding a specified error threshold for a sample at a maximum specified sampling rate. An error code is a code that differs by more than 4 LSB from the correct code The differential non-linearity for an output code i is the difference between the measured step size of code i and the ideal LSB step size. DNL (i) is expressed in LSBs. DNL is the maximum value of all DNL (i). A DNL error specification of less than 1 LSB guarantees that there are no missing output codes and that the transfer function is monotonic ASINAD - 1.76 + 20 log ---------Fs/2 ENOB = ---------------------------------------------------------------------------6.02 Where A is the actual input amplitude and Fs is the full scale range of the ADC under test
DNL
Differential Non-Linearity
ENOB
Effective Number of Bits
FPBW
Full Power Input Bandwidth Inter-Modulation Distortion Integral Non-Linearity Aperture uncertainty
The analog input frequency at which the fundamental component in the digitally reconstructed output waveform has fallen by 3 dB with respect to its low frequency value (determined by FFT analysis) for input at full-scale -1 dB (-1 dBFS) The two tones intermodulation distortion (IMD) rejection is the ratio of either of the two input tones to the worst third order intermodulation products The integral non-linearity for an output code i is the difference between the measured input voltage at which the transition occurs and the ideal value of this transition. INL (i) is expressed in LSBs and is the maximum value of all |INL (i)| The sample-to-sample variation in aperture delay. The voltage error due to jitters depends on the slew rate of the signal at the sampling point The NPR is measured to characterize the ADC's performance in response to broad bandwidth signals. When applying a notch-filtered broadband white noise signal as the input to the ADC under test, the Noise Power Ratio is defined as the ratio of the average out-ofnotch to the average in-notch power spectral density magnitudes for the FFT spectrum of the ADC output sample test
IMD
INL
JITTER
NPR
Noise Power Ratio
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Table 14. Definitions of Terms (Continued)
Abbreviation ORT PSRR Definition Overvoltage Recovery Time Power Supply Rejection Ratio Spurious Free Dynamic Range Signal to Noise and Distortion Ratio Signal to Noise Ratio Small Signal Input Bandwidth Aperture delay Encoding Clock period Time Delay from Data Transition to Data Ready Time Delay from Data Ready to Data Digital Data Output Delay Data Ready Output Delay Fall Time Total Harmonic Distortion Pipeline Delay Rise Time Description The time to recover a 0.2% accuracy at the output, after a 150% full-scale step applied on the input is reduced to midscale The ratio of input offset variation to a change in power supply voltage The ratio expressed in dB of the RMS signal amplitude, set at 1 dB below full-scale, to the RMS value of the highest spectral component (peak spurious spectral component). The peak spurious component may or may not be a harmonic. It may be reported in dB (related to the converter -1 dB full-scale) or in dBc (related to the input signal level) The ratio expressed in dB of the RMS signal amplitude, set to 1 dB below full-scale (-1 dBFS) to the RMS sum of all other spectral components including the harmonics, except DC The ratio expressed in dB of the RMS signal amplitude, set to 1 dB below full-scale, to the RMS sum of all other spectral components excluding the first 9 harmonics The analog input frequency at which the fundamental component in the digitally reconstructed output waveform has fallen by 3 dB with respect to its low frequency value (determined by FFT analysis) for input at full-scale -10 dB (-10 dBFS) The delay between the rising edge of the differential clock inputs (CLK, CLKB) [zero crossing point] and the time at which VIN and VINB are sampled TC1 = minimum clock pulse width (high) TC = TC1 + TC2 TC2 = minimum clock pulse width (low) The general expression is TD1 = TC1 + TDR - TDO with TC = TC1 + TC2 = 1 encoding clock period The general expression is TD2 = TC2 + TDR - TDO with TC = TC1 + TC2 = 1 encoding clock period The delay from the rising edge of the differential clock inputs (CLK, CLKB) [zero crossing point] to the next point of change in the differential output data (zero crossing) with a specified load The delay from the falling edge of the differential clock inputs (CLK, CLKB) [zero crossing point] to the next point of change in the differential output data (zero crossing) with a specified load The time delay for the output data signals to fall from 20% to 80% of delta between the low and high levels The ratio expressed in dB of the RMS sum of the first 9 harmonic components to the RMS input signal amplitude, set at 1 dB below full-scale. It may be reported in dB (related to the converter -1 dB full-scale) or in dBc (related to the input signal level ) The number of clock cycles between the sampling edge of an input data and the associated output data made available (not taking into account the TDO) The time delay for the output data signals to rise from 20% to 80% of delta between the low and high levels
SFDR
SINAD SNR
SSBW
TA
TC
TD1
TD2
TDO
TDR
TF
THD
TPD TR
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Table 14. Definitions of Terms (Continued)
Abbreviation TRDR TS VSWR Definition Data Ready Reset Delay Settling Time Voltage Standing Wave Ratio Description The delay between the falling edge of the Data Ready output asynchronous reset signal (DDRB) and the reset to digital zero transition of the Data Ready output signal (DR) The time delay to rise from 10% to 90% of the converter output when a full-scale step function is applied to the differential analog input The VSWR corresponds to the ADC input insertion loss due to input power reflection. For example, a VSWR of 1.2 corresponds to a 20 dB return loss (99% power transmitted and 1% reflected)
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Using the AT84AD004 Dual 8-bit 500 Msps ADC
Decoupling, Bypassing and Grounding of Power Supplies
The following figures show the recommended bypassing, decoupling and grounding schemes for the dual 8-bit 500 Msps ADC power supplies.
Figure 48. VCCD and VCCA Bypassing and Grounding Scheme
L
PC Board 3.3V VCCD
1F
PC Board GND
L
100 pF
VCCA
C
Figure 49. VCCO Bypassing and Grounding Scheme
C
L
PC Board 2.25V VCCO
1F
PC Board GND
100 pF
C
Note:
L and C values must be chosen in accordance with the operating frequency of the application.
Figure 50. Power Supplies Decoupling Scheme
VCCA
VCCA
100 pF 10 nF
GNDA
GNDA
VCCO
VCCO
VCCD
GNDO
100 pF 10 nF
GNDO
100 pF 10 nF
GNDD
Note: The bypassing capacitors (1 F and 100 pF) should be placed as close as possible to the board connectors, whereas the decoupling capacitors (100 pF and 10 nF) should be placed as close as possible to the device.
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Analog Input Implementation
The analog inputs of the dual ADC have been designed with a double pad implementation as illustrated in Figure 51. The reverse pad for each input should be tied to ground via a 50 resistor. The analog inputs must be used in differential mode only. Figure 51. Termination Method for the ADC Analog Inputs in DC Coupling Mode
50 VinI 50 Source Channel I
GND
VinI
VinIB
GND
50 VinIB 50 VinQ Dual ADC
50 Source Channel Q
GND GND
VinQ
VinQB 50 VinQB
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Figure 52. Termination Method for the ADC Analog Inputs in AC Coupling Mode
50 VinI 50 Source Channel I
GND
VinI
VinIB
GND
50 VinIB 50 VinQ Dual ADC
50 Source Channel Q
GND GND
VinQ
VinQB 50 VinQB
Clock Implementation
The ADC features two different clocks (I or Q) that must be implemented as shown in Figure 53. Each path must be AC coupled with a 100 nF capacitor. Figure 53. Differential Termination Method for Clock I or Clock Q
ADC Package
100 nF 50
VCCD/2
100 nF CLKB
50
Note:
When only clock I is used, it is not necessary to add the capacitors on the CLKQ and CLKQN signal paths; they may be left floating.
50
AT84AD004
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Differential Buffer
CLK
AT84AD004
Figure 54. Single-ended Termination Method for Clock I or Clock Q
VCCD AC coupling capacitor 50 Source R1 CLK
50
50 AC coupling capacitor CLKB
R2
50 VCCD/2
Output Termination in 1:1 Ratio
When using the integrated DMUX in 1:1 ratio, the valid port is port A. Port B remains unused. Port A functions in LVDS mode and the corresponding outputs (DOAI or DOAQ) have to be 100 differentially terminated as shown in Figure 55 on page 52. The pins corresponding to Port B (DOBI or DOBQ pins) must be left floating (in high impedance state). Figure 55 on page 52 is an example of a 1:1 ratio of the integrated DMUX for channel I (the same applies to channel Q).
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Figure 55. Example of Termination for Channel I Used in DMUX 1:1 Ratio (Port B Unused)
DOBI0 / DOBI0N DOBI1 / DOBI1N DOBI2 / DOBI2N Port B DOBI3 / DOBI3N DOBI4 / DOBI4N DOBI5 / DOBI5N DOBI6 / DOBI6N DOBI7 / DOBI7N Dual ADC Package DOAI0 / DOAI0N DOAI1 / DOAI1N DOAI2 / DOAI2N DOAI3 / DOAI3N Port A DOAI4 / DOAI4N DOAI5 / DOAI5N DOAI6 / DOAI6N DOAI7 / DOAI7N
DOAI0N DOAI0
Floating (High Z)
VCCO
Z0 = 50
LVDS In
Z0 = 50
100
LVDS In
Note:
If the outputs are to be used in single-ended mode, it is recommended that the true and false signals be terminated with a 50 resistor.
Using the Dual ADC With Figure 56 on page 53 illustrates the configuration of the dual ADC (1:2 DMUX mode, independent I and Q clocks) driving an LVDS system (ASIC/FPGA) with potential addiand ASIC/FPGA Load
tional DMUXes used to halve the speed of the dual ADC outputs.
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Figure 56. Dual ADC and ASIC/FPGA Load Block Diagram
Data rate = FsI/2
Port A Channel I
DEMUX 8 :16
Data rate = FsQ/2 CLKI/CLKIN @ FsI Port A Dual 8-bit 1 Gsps ADC Channel Q
Data rate = FsQ/4
DMUX 8 :16
ASIC / FPGA
Port B Channel I
DMUX 8 :16
CLKQ/CLKQN @ FsQ
Port B Channel Q
DMUX 8 :16
Note:
The demultiplexers may be internal to the ASIC/FPGA system.
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Thermal Characteristics
Simplified Thermal Model for LQFP 144 20 x 20 x 1.4 mm
The following model has been extracted from the ANSYS FEM simulations. Assumptions: no air, no convection and no board.
Figure 57. Simplified Thermal Model for LQFP Package
Silicon Junction 355 m silicon die 25 mm 2 = 0.95W/cm/C
40 m Epoxy/Ag glue = 0.02 W/cm/C Copper paddle = 2.5W/cm/C Aluminium paddle = 0.75W/cm/C Resin bottom = 0.007W/cm/C 0.6C/watt
8.3C/watt Resin
= 0.007W/cm/C
Package top
1.4C/watt 0.1C/watt
6.1C/watt 1.5C/watt 5.5C/watt
Leads tip
0.1C/watt
Aluminium paddle Resin Copper alloy leadframe = 0.007W/cm/C = 25W/cm/C
4.3C/watt Package bottom
100 m air gap = 0.00027W/cm/C 11.4C/watt
Assumptions: Die 5.0 x 5.0 = 25 mm 2 40 m thick Epoxy/Ag glue
Package bottom connected to: 100 m thermal grease gap diamater 12 mm = 0.01W/cm/C (user dependent) 1.5C/watt
Top of user board
Note:
The above are typical values with an assumption of uniform power dissipation over 2.5 x 2.5 mm2 of the top surface of the die.
Thermal Resistance from Junction to Bottom of Leads Thermal Resistance from Junction to Top of Case Thermal Resistance from Junction to Bottom of Case Thermal Resistance from Junction to Bottom of Air Gap
Assumptions: no air, no convection and no board. The thermal resistance from the junction to the bottom of the leads is 15.2 C/W typical. Assumptions: no air, no convection and no board. The thermal resistance from the junction to the top of the case is 8.3 C/W typical. Assumptions: no air, no convection and no board. The thermal resistance from the junction to the bottom of the case is 6.4 C/W typical. The thermal resistance from the junction to the bottom of the air gap (bottom of package) is 17.9 C/W typical.
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Thermal Resistance from Junction to Ambient The thermal resistance from the junction to ambient is 25.2 C/W typical.
Note: In order to keep the ambient temperature of the die within the specified limits of the device grade (that is TA max = 70C in commercial grade and 85C in industrial grade) and the die junction temperature below the maximum allowed junction temperature of 105C, it is necessary to operate the dual ADC in air flow conditions (1m/s recommended). In still air conditions, the junction temperature is indeed greater than the maximum allowed TJ. - TJ = 25.2C/W x 1.4W + TA = 35.28 + 70 = 105.28C for commercial grade devices - TJ = 25.2C/W x 1.4W + TA = 35.28 + 85 = 125.28C for industrial grade devices
Thermal Resistance from Junction to Board
The thermal resistance from the junction to the board is 13 C/W typical.
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Ordering Information
Part Number AT84XAD004TD AT84AD004CTD AT84AD004VTD AT84AD004TD-EB
Package LQFP 144 LQFP 144 LQFP 144 LQFP 144
Temperature Range Ambient C grade 0C < TA < 70C V grade -40C < TA < 85C Ambient
Screening Prototype Standard Standard Prototype
Comments Prototype version Please contact your local Atmel sales office
Evaluation kit
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Packaging Information
Figure 58. Package Type
N 1
Dims. A A1 A2 D D1 E E1 L e b ddd ccc o
Notes:
A
B E1
E
Body +2.00 mm footprint Tols. Leads 144L max. 1.60 0.05 min./0.15 max. +/- 0.05 1.40 +/-0.20 22.00 +/-0.10 20.00 +/-0.20 22.00 +/-0.10 20.00 +0.15/-0.10 0.60 basic 0.50 +/-0.05 0.22 0.08 max. 0.08 o 0 o- 5
D D1 D
12 o TYP.
1. All dimensions are in millimeters 2. Dimensions shown are nominal with tolerances as indicated 3. L/F: eftec 64T copper or equivalent 4. Foot length: "L" is measured at gauge plane at 0.25 mm above the seating plane
A2
A1
e
12 TYP.
o
A
0.20 RAD max.
0.20 RAD nom.
6o
+o -4
A
C
0.25 0 b ddd e
Stand off A1 Seating plane C Lead coplanarity De ccc
0.17 max
L
c A-B e
c
Note:
Thermally enhanced package: LQFP 144, 20 x 20 x 1.4 mm.
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